The Singapore Institute of Technology (SIT) has signed a Memorandum of Understanding (MOU) with a semiconductor materials engineering leader enterprise to develop and implement continuing education and training (CET) programmes for Applied Materials employees. The initiative emphasises the significance of developing and sustaining a future-ready talent pipeline in Singapore to serve the global semiconductor industry.
“Our collaboration with Applied Materials offers valuable opportunities for the company’s employees to equip themselves with knowledge of in-demand skills in areas such as artificial intelligence and the Internet of Things,” says Professor Chua Kee Chaing, SIT President.
He also stated that the programmes will capitalise on SIT’s strengths in applied learning and research, as well as contribute to capacity building in the local semiconductor industry and its ecosystem.
The MOU will provide customised learning programmes related to Industry 4.0 concepts such as artificial intelligence, data engineering, the Internet of Things, machine learning and smart factories. The curriculum and duration of the programmes are tailored to the needs of Applied Materials employees, and they include both short and long courses, as well as stackable post-graduate modules taught by SIT academic staff.
SIT also collaborated with one of the region’s leading oil and gas infrastructure services companies to investigate collaborative efforts and projects in education, workplace learning, and innovation for the chemicals and energy industries.
Both parties will collaborate to co-create training programmes to provide enterprise employees with relevant workplace learning and upskilling opportunities, including specialised training programmes to support the Engineering, Procurement, and Construction (EPC) sector.
Under the terms of the MOU, both parties intend to advance students’ skills in the chemicals and energy sectors by providing internship and learning opportunities to SIT students through SIT’s Integrated Work Study Programme (IWSP) and Capstone Projects. SIT students and faculty will also be involved in relevant innovation projects and will deliver integrated solutions to business challenges.
SIT also signed an MOU with the global leader in low-carbon energy and services to collaborate on the development of a district cooling centre of excellence in Singapore. The MOU will spur innovation in cooling solutions throughout APAC. This initiative aims to cultivate a district cooling ecosystem in Singapore and the broader region by leveraging local and global expertise in cooling, extensive experience in decarbonisation, energy, and climate change projects, and SIT’s applied learning and research approach.
To that end, SIT and its partner will collaborate on the development and funding of applied research, as well as knowledge exchange projects. Through SIT’s IWSP, it will also cover local work attachment opportunities and commercial district cooling system development opportunities for SIT students.
Meanwhile, several brilliant young minds came together at the recently concluded SIT Hackathon 2022: Sustainability in Space to develop solutions centred on “How to Live in Space for 365 Days.”
A plastic shredder, an extruder, and a 3D printer were made by Team REPA. The plan is to shred the waste plastic, which will then be heated with the extruder to create filament for 3D printers. The objective is to use 3D printing to create necessary portable objects to aid astronauts on the International Space Station (ISS).
Team AMICA proposed using 3D printing to re-establish a space station. With their Advanced Manufacturing and Innovation Capsule (AMICA), they move the manufacturing and assembly to space. AMICA includes a 3D printing system, an astronaut control room, a furnace for metal work, and remote-controlled external robotic arms to assemble modules outside the capsule.
Team Legstronk is also attempting to recycle waste space debris. Their proposal is to 3D print and builds space structures out of cement mixed with repurposed space debris.
Dead satellites in orbit around the Earth could endanger future space activities. As a result, Team SCV designed a Space Construction Vehicle (SCV) to recycle these space wastes into 3D printing filament.
The hackathon participants’ ideas bring the country one step closer to a future in which humanity has a home beyond the void.
