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The Hong Kong Science and Technology Parks Corporation (HKSTP), in collaboration with the Hong Kong University of Science and Technology (HKUST) and a semiconductor supplier in Hong Kong recently held a microelectronics conference at the Hong Kong Science Park. Various stakeholders from the industry, academia, and research sectors, gathered to elevate Hong Kong’s status as a global leader in microelectronics innovation and talent development.
Over 40 technological innovations from entities such as HKSTP Park firms, HKUST spin-offs, and partners of the supplier were showcased. These demonstrations underscored Hong Kong’s diverse capabilities in the field of microelectronics innovation and applications.
The primary focus was on key innovation areas, including smart mobility, healthcare, and new energy. Distinguished leaders and experts in the global microelectronics arena shared their insights across three conference tracks: talent, research, and industry, with the aim of inspiring the next generation of professionals.
The event also marked the one-year anniversary of the strategic co-incubation programme between HKSTP and Infineon. This program has been instrumental in providing specialised training, laboratory resources, and technical expertise to burgeoning microelectronics ventures.
To date, nearly 200 partner companies, universities, and InnoHK Centres associated with HKSTP have benefitted from this initiative, which covers various microelectronics themes. Additionally, six practical application projects are currently under development through collaborations with Park companies.
The Hong Kong Special Administrative Region (HKSAR) Government has identified the development of the microelectronics industry as a key component of the city’s Innovation and Technology (I&T) ecosystem, in alignment with the “Hong Kong I&T Development Blueprint.”
This strategic direction aligns with projections that the global semiconductor industry will exceed US$1 trillion by 2030, with the Asia-Pacific region expected to command a substantial 62% market share. Hong Kong, as one of the world’s major importers and exporters of semiconductors, occupies a pivotal role in the global semiconductor supply and value chain, especially given its strategic location within the Greater Bay Area (GBA).
The Secretary for Innovation, Technology and Industry of the HKSAR Government expressed enthusiasm about the establishment of a Microelectronics Ecosystem in Hong Kong. He emphasised the belief that nurturing this ecosystem would catalyse economic growth, drive technological advancements, foster collaboration, nurture talent, diversify industries, and enhance global recognition. Such efforts have the potential to position Hong Kong as a prominent player in the field of microelectronics and contribute to its long-term development as an innovation-driven economy.
The CEO of HKSTP echoed these sentiments, emphasising Hong Kong’s unique position as a hub for microelectronics innovation within the Greater Bay Area. Together with partners HKUST and Infineon, the Microelectronics Ecosystem Conference is envisioned as a platform to unleash Hong Kong’s full potential and establish a world-class microelectronics sector as a foundational pillar in the city’s pursuit of becoming a global Innovation and Technology hub.
The microelectronics community in Hong Kong has already achieved significant research breakthroughs spanning a wide range of areas, including chip design, advanced packaging, and silicon photonics. Notably, HKSTP has experienced substantial growth, more than doubling the number of chip and device companies from 40 in 2020 to over 90 today. The HKSTP ecosystem has given rise to a total of 249 microelectronics-related companies, illustrating the rapid expansion of this sector.
To support this burgeoning growth, HKSTP has developed an extensive network of microelectronics hardware infrastructure and capabilities. This comprehensive support system facilitates the entire process from conceptualisation to product creation for emerging tech ventures. The suite of facilities provided by HKSTP includes the Sensor Packaging and Integration Laboratory (Sensor Lab), Heterogeneous Integration Lab (HI Lab), Microelectronics Centre (MEC), the Hardware Lab, and ProShop. Together, these facilities cover the entire spectrum of design, prototyping, and pilot production of chips, devices, and related systems and products.
