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The Hong Kong Science and Technology Parks Corporation (HKSTP) and a company specialising in automotive-grade intelligent vehicle chip and solution development company (the company) have signed an agreement to establish the “Black Sesame Hong Kong Technology Innovation R&D Center” at the Hong Kong Science Park.
This collaboration aims to jointly develop a cutting-edge intelligent vehicle chip platform with automotive-grade capabilities, enhancing Hong Kong’s microelectronics ecosystem and fostering growth in the automotive chip industry.
Under the leadership of the Innovation, Technology, and Industry Bureau (ITIB) and the Office for Attracting Strategic Enterprises (OASES), this partnership between the two parties is dedicated to advancing Hong Kong’s intelligent vehicle sector and strengthening microelectronics research and development.
The memorandum of understanding was signed by the Chief Corporate Development Officer of HKSTP, and the Chief Marketing Officer of the company, and was witnessed by prominent officials and industry leaders.
As part of this collaboration, the company will establish the R&D centre at Hong Kong Science Park, focusing on high-performance automotive-grade chip research and development. The company also plans to invest approximately US$100 million by the end of 2027 and expand its local research and development team to around 100 experts.
The Secretary for Innovation, Technology, and Industry noted that the company’s decision to establish a presence in Hong Kong underscores the city’s capabilities in innovation and technology. This partnership will not only strengthen Hong Kong’s position in the new energy vehicle field but also facilitate collaboration between Mainland China and overseas industries, attracting more technology and research talent to Hong Kong.
The CEO of HKSTP highlighted the significance of the company’s arrival in Hong Kong, emphasising the city’s potential for microelectronics industry growth. HKSTP plans to work closely with the company to promote the high-end chip industry in Hong Kong and build a comprehensive global chip supply chain and a hub for microelectronics talent.
The Founder and CEO of the company expressed how Hong Kong’s strategic location and research and development capabilities make it an ideal partner for the firm. The collaboration will contribute to both Hong Kong’s innovation and technology goals and the development of China’s intelligent vehicle industry.
This collaboration aligns with the “Hong Kong Innovation and Technology Development Blueprint” and the establishment of the “Hong Kong Microelectronics Research and Development Institute,” which aims to drive microelectronics research, including third-generation semiconductor core technologies.
The company, a leader in automotive-grade intelligent vehicle chip production, brings over two decades of experience in the automotive chip sector. They provide products and technologies essential for intelligent vehicles, such as autonomous driving and advanced imaging.
HKSTP is committed to advancing Hong Kong’s industrialisation mission and building a world-leading microelectronics ecosystem, offering state-of-the-art facilities and infrastructure for chip-related research and development.
Hong Kong’s vibrant microelectronics ecosystem, including over 200 microelectronics-related companies and top-ranking universities, positions the city to nurture top talent and expertise in high-end chips and semiconductors.
The collaboration between the company and HKSTP represents a significant step in advancing Hong Kong’s microelectronics and automotive chip industry, fostering innovation in intelligent vehicle technology and strengthening Hong Kong’s position on the global tech map.
