Caltech engineers collaborated with the University of Southampton in England to design an ultrahigh-speed data transfer chip. The chip integrates both an electronics chip and a photonics chip which uses light to transfer data. It took four years to complete, from the initial idea to the final test in the lab.
“As the world becomes increasingly connected, and every device generates more data, it is exciting to show that we can achieve such high data rates while burning a fraction of power compared to the traditional techniques. We had to optimise the entire system all at the same time, which enabled achieving a superior power efficiency,” said Azita Emami, the Andrew and Peggy Cherng Professor of Electrical Engineering and Medical Engineering, Executive Officer for Electrical Engineering and senior author of the paper.
The research paper is titled “A 100Gb/s PAM4 Optical Transmitter in A 3D-Integrated SiPh-CMOS Platform Using Segmented MOSCAP Modulators.” Rockley Photonics and the U.K. Engineering and Physical Sciences Research Council funded this research.
The need for high processing power and transmission creates the inevitable excess heat. Heat is the enemy of the speed and the amount of data a computer device can manage. It happens not just for personal computers or laptops but also for data centres.
While a laptop may heat up while when in use, servers in data centres also heat up as they work – but at a much grander scale. Therefore, managing heat in the data centre is essential. The less heat, the more computing power is generated and the greater the volume of information it can handle.
Hence, engineers tried to find a way to increase the processing speed while keeping the heat low. The solution was to design and co-optimise an electronics chip and a photonics chip. The chip is innovative because it integrates an electronic circuit essential for data processing, combined with a photonics chip which is the most efficient piece for data transmission.
The Caltech/Southampton integrated chip can transmit 100 gigabits of data per second! Moreover, the integrated chip generates minimal heat, producing just 2.4 pico-Joules per transmitted bit. The result increases the electro-optical power efficiency by 3.6 times compared to the current technology.
Handling Next-level Computing
In the future, data centres will manage very high volumes of data compared to today. The new design integrated chip will answer a continuous demand for increasing data communication speed in data centres and high-performance computers.
“As the computing power of the chips scale, the communication speed can become the bottleneck, especially under stringent energy constraints,” Emami explained.
The high-demand data transmission and processing from a data-demanding task, such as a video call, streaming a movie, or playing an online video game, need high processing power in the data centre.
“There are more than 2,700 data centres in the U.S. and more than 8,000 worldwide, with towers of servers stacked on top of each other to manage the load of thousands of terabytes of data going in and out every second,” says a Caltech graduate student Arian Hashemi Talkhooncheh (MS ’16), lead author of a paper describing the two-chip innovation that was published in the IEEE Journal of Solid-State Circuits.
The 13th Singapore-US Strategic Security Policy Dialogue (SSPD) was convened, and co-chaired by Permanent Secretary of Defence, Chan Heng Kee and United States Acting Under Secretary of Defense for Policy, Sasha Baker. This dialogue, embedded within the 2005 Strategic Framework Agreement and Defence Cooperation Agreement, serves as a cornerstone for shaping the future of Singapore-US defence relations.
Beyond the traditional domains of defence, Singapore and the US are venturing into uncharted territory – cybersecurity and critical emerging technologies. This signifies a strategic shift that acknowledges the evolving nature of security threats in the digital age.
Both nations have recognised the enduring strength of their bilateral defence relationship. Singapore’s unwavering support for the U.S. regional presence, outlined in the 1990 Memorandum of Understanding (MoU) Regarding the U.S. use of Facilities (1990 MoU), remains a crucial pillar of their alliance. Simultaneously, the US continues to bolster the Singapore Armed Forces (SAF) capabilities through overseas training and technology access. This includes the RSAF’s acquisition of the cutting-edge F-35 fighter aircraft.
The dialogue marked a significant milestone by introducing discussions on cybersecurity. In an interconnected world, where information is power, securing digital infrastructure cannot be overstated.
By engaging in collaborative efforts to enhance their cyber defences, Singapore and the US are not only safeguarding their interests but also contributing to global cybersecurity resilience. This proactive approach sets a precedent for other nations to follow suit and collectively combat cyber threats.
Also, the emphasis on critical and emerging technologies highlights the foresight of both nations. In today’s fast-paced technological landscape, advancements in areas such as artificial intelligence (AI), quantum computing, and biotechnology can tip the scales of national security.
By pooling their expertise and resources, Singapore and the US are positioning themselves at the forefront of innovation, ensuring they are well-prepared for the security challenges of the future.
The dialogue also featured discussions on regional developments and the continued engagement of the US in the Asia-Pacific region. The ASEAN Defense Ministers’ Meeting (ADMM)-Plus framework serves as a platform for constructive dialogue and cooperation among ASEAN member states and their partners. Singapore and the US both recognise the significance of this framework in promoting regional stability and security.
Regular bilateral and multilateral training exercises form another vital facet of this partnership. Exercises like Tiger Balm, Pacific Griffin, Commando Sling, Red Flag, and Super Garuda Shield serve as platforms for joint training and skill development. These exercises not only enhance the operational readiness of both armed forces but also foster greater cooperation and understanding between Singapore and the US.
One noteworthy aspect of this collaboration is the US’s support for SAF’s overseas training, exemplified by Exercise Forging Sabre. This training, conducted at Mountain Home Air Force Base, Idaho, has played a pivotal role in honing the skills of RSAF personnel.
In 2023, two RSAF detachments, Peace Carvin II (F-16 fighter aircraft) and Peace Vanguard (Apache AH-64 helicopters), marked their 30th and 20th anniversaries of training in the US, respectively. These milestones are a testament to the enduring nature of the Singapore-US defence relationship.
The 13th Singapore-US Strategic Security Policy Dialogue not only reaffirmed the steadfast commitment of both nations to their long-standing defence partnership but also showcased their readiness to adapt to the evolving security landscape.
As reports cited the inclusion of cybersecurity and critical emerging technologies in the discussions reflects the forward-thinking approach to safeguarding the national interests of both nations. As they continue to train together, exchange knowledge, and invest in cutting-edge technologies, Singapore and the US are poised to navigate the complex challenges of the future, hand in hand.
The Hong Kong Monetary Authority (HKMA) announced the initiation of the Green Fintech Competition, which will serve as a pivotal step towards promoting the integration of innovative green fintech solutions within the Hong Kong banking sector. The primary objective of this initiative is to bolster the resilience of the banking industry against the looming climate risks.
The competition is a call to action for both local green fintech companies and their international counterparts. It invites these innovative firms to participate and demonstrate how their technological solutions can be harnessed effectively within the banking industry. The competition centres around four key themes, each addressing a crucial aspect of sustainable finance:
- Net-zero Transition or Transition Planning: This theme emphasises the pivotal role of fintech in facilitating the transition towards a net-zero economy. It aims to uncover innovative solutions that can assist banks in their journey towards carbon neutrality.
- Climate Risk Management: Climate risks have become a central concern in the financial sector. Fintech solutions are sought to help banks better understand, assess, and manage these risks effectively.
- Green and Sustainable Finance: The theme of green and sustainable finance underscores the importance of fintech in enabling financial institutions to channel their resources towards environmentally responsible investments.
- Sustainability or Climate-related Disclosure and Reporting: Transparency and disclosure are critical components of sustainable finance. Fintech solutions that enhance the disclosure and reporting of sustainability and climate-related information are in high demand.
These themes were carefully crafted in response to industry feedback, reflecting the pressing challenges faced by the Hong Kong banking sector. The competition encourages participating firms to develop market-ready solutions that align with at least one of these themes. Detailed problem statements for each theme can be found on the official competition website, offering valuable guidance for prospective participants. Firms are also free to propose alternative problem statements that they believe are relevant to the overarching themes.
A panel of judges will evaluate the submitted solutions, comprising representatives from the public and private sectors. This panel includes experts from the banking and technology sectors, professional associations, and academia. The winners of the competition will be granted a unique opportunity to fast-track their entry into the Cyberport Incubation Program. This program is designed to provide comprehensive business support, aiding in the development and growth of green fintech solutions.
Finalists will be invited to participate in and host exhibition booths at the HKMA’s “Green and Sustainable Banking Conference,” scheduled for December 2023, offering a platform for in-depth exchanges with industry professionals and an opportunity to showcase their solutions. It also serves as a valuable forum for exploring potential collaborations with key stakeholders in the financial sector.
In addition to these benefits, participants will have access to tailored consultation services provided by InvestHK. These services are designed to offer further insights into the Hong Kong market, ensuring that their fintech solutions are finely tuned to meet the specific needs and demands of this dynamic financial hub.
The initiative represents a significant step forward in embracing innovative fintech solutions to address critical environmental and sustainability challenges. By inviting participation from both local and global green fintech firms, the competition aims to harness the collective power of technology and finance to build a more sustainable future for the banking industry in Hong Kong and beyond.
Previously, OpenGov Asia reported on the recent bilateral meeting between the Central Bank of the United Arab Emirates (CBUAE) and the Hong Kong Monetary Authority (HKMA) holds great significance for the Green Fintech Competition initiated by the HKMA. During the meeting, the central banks agreed to strengthen collaboration in key areas including financial infrastructure, financial market connectivity, and virtual asset regulations, all of which align with the competition’s objectives.
This collaboration, along with the establishment of a joint working group and knowledge-sharing initiatives, is set to amplify the impact of initiatives like the Green Fintech Competition by creating a more interconnected and sustainable global financial ecosystem.
The Centre for Memory Studies at the Indian Institute of Technology, Madras (IIT-Madras) has introduced the ‘MovingMemory’ application, which harnesses both augmented reality and virtual reality (AR/VR) technologies to capture diverse moving models of memory through digital reconstruction. It was designed to enhance the tourist experience at cultural and heritage sites. It offers virtual tours of famous places in India.
The app’s features allow users to choose their preferred avatar and navigate through three-dimensional spaces. According to a statement from IIT-Madras, it is embedded with additional layers of video, audio, 3D images, and interactive elements which may be used as models for sustainable and heritage-oriented pedagogic and research approaches.
Once the app becomes available to the public, MovingMemory can be accessed from both Android and iOS devices, as well as through browser-based platforms, setting it apart as a uniquely inclusive application. It is a spatial app created with the capability to exist within the metaverse realm.
MovingMemory was introduced at the second annual conference of the Indian Network for Memory Studies, titled ‘Memory, Ecology, and Sustainability.’ It was organised jointly by the Indian Network for Memory Studies and the Centre for Memory Studies at IIT- Madras. It covers a wide range of human-centred technologies and policies related to cultural memory and sustainable development goals, both within India and on a global scale.
At the inaugural event, IIT-Madras Director, V. Kamakoti, said, “It is crucial that we foreground the urgent need to incorporate collective memory in our understanding and ability to anticipate policies related to ecological issues such as climate change. Human as well as non-human forms of memory (such as the memory of water and the memory of nature) such as the Spanish Flu and the 2015 Chennai floods may be studied through interdisciplinary and collaborative formats in order to further memory studies as a discipline.”
The conference aims to connect rituals of remembering and experiencing the environment to systems of sustainability, which assume material, cultural, and technological dimensions through significant events like disasters and floods and long-term processes of change.
The international conference attracted approximately 100 presenters and more than 500 attendees from across India, the United States, the United Kingdom, Germany, New Zealand, Morocco, Canada, Sweden, Bangladesh, and other countries.
An official at the event said that the conference, like all other research activities at the Centre for Memory Studies at IIT-Madras, seeks to bridge technology studies and humanities. Its purpose is to provide a more complex model of engaging with memory, ecology, and sustainability, while also connecting to issues such as disaster studies, anticipatory governance, and durability.
Another expert from IIT-Madras noted the importance of reexamining pre-modern modes of memory and resilience and integrating those with the post-modern modes through which ecology and sustainability practices may receive a more nuanced understanding. These interdisciplinary practices have triggered a paradigm shift in both humanities education and research.
IIT-Madras has undertaken several initiatives in the field of AR/VR. In April, it announced it was developing instructional and educational models that use AR/VR technologies, aimed at assisting secondary schools in rural regions of the country. As OpenGov Asia reported, the initiative provides students with unique opportunities to engage in immersive and experiential learning through VR-enabled technology. Subjects like social science, history, sciences, and languages can be effectively taught using AR/VR world-building, digital storytelling, and educational games. An inaugural AR-based mobile app was launched to capture the history of the transnational Anglo-Indian community across 500 years.
The technology landscape constantly seeks high-power, energy-efficient devices. 3D-stacked electronics offer exciting potential, but overheating is a challenge due to their compact design. Excess heat can cause performance issues and damage. Thankfully, a new solution involving magnetic fields and innovative materials has emerged to address this challenge, ensuring these devices remain cool and efficient.
At the forefront of this breakthrough is a team of scientists led by Assistant Professor Hortense Le Ferrand of the Nanyang Technological University of Singapore – School of Mechanical and Aerospace Engineering. They have embarked on a journey to tame the heat generated by 3D-stacked electronics and ensure they operate at peak performance.
The key to their innovation lies in a material called hexagonal boron nitride (BN), known for its exceptional heat-dissipating properties. To make BN responsive to their needs, the researchers coated microscopic BN particles with iron oxide. This strategic move rendered the particles magnetic, paving the way for precise control.
Next, they suspended these coated particles in a solvent and brought magnetic fields into play. The magic happened as the magnetic fields aligned the BN particles in various orientations. This alignment turned out to be the key to effective heat management.
The team conducted rigorous tests to gauge the heat-dissipating capabilities of these precisely oriented BN particles. What they discovered was nothing short of revolutionary: when the particles were aligned vertically, they proved incredibly efficient at channelling heat away from their source. This breakthrough alone promised a significant leap forward in the cooling technology of high-power devices.
But the innovation didn’t stop there. The orientation of the particles could also be tailored to direct heat in different directions, a flexibility that opens a world of possibilities. For instance, when these particles find themselves sandwiched between two heat-emitting electronic components, they can be configured to direct heat sideways, ensuring optimal thermal management.
Assist Prof Hortense believes this novel approach to aligning and orienting BN particles offers exciting new prospects for managing heat in high-power electronic devices. It’s a promising development that could pave the way for the widespread adoption of 3D-stacked electronics, ushering in an era of high-performance, energy-efficient devices without the nagging concern of overheating.
Preventing high-power devices ensures sustained performance. Overheating can cause these devices to throttle their performance or even shut down altogether. This can have a significant impact on productivity and functionality, especially in critical applications.
Further, managing heat is crucial for the longevity of these devices. Excessive heat can damage internal components over time, leading to a shorter lifespan. This, in turn, can result in frequent replacements, which can be costly for both consumers and manufacturers.
Besides, there are safety concerns associated with overheating. In extreme cases, it can pose a fire hazard or create electrical safety risks. Proper heat management is vital to mitigate these dangers and ensure the safe operation of high-power devices.
Efficient cooling also contributes to energy efficiency. When devices operate within their optimal temperature range, they consume less power. This not only reduces energy costs but also lessens the environmental impact.
Also, reliable operation is paramount for high-power devices, particularly in critical applications like medical equipment and aerospace technology. Overheating can lead to system failures, which may have severe consequences; hence, effective heat management is crucial to maintain the reliability of these devices.
The Indian Institute of Technology, Madras (IIT-Madras) has revealed that its scientists creating a portable, point-of-use device for identifying heavy metals in both soil and water. Research from the Ministry of Jal Shakti shows that over 36,000 rural habitations in India are grappling with issues related to contamination from fluoride, arsenic, and heavy metals in their drinking water sources.
According to a statement from IIT-Madras, the primary aim of the research is to package the technology into an engineered device, which will be programmed to deliver a user-friendly, non-technical read-out value of the soil quality index on a mobile phone-like application.
Currently, there are no field-usable or point-of-use solutions available for laypeople to use for detecting heavy metals in soil. The presence of heavy metals in soil also impacts soil quality by contributing to soil salinity. This can have a detrimental impact on global food security due to decreased agricultural yields and potential adverse effects on human health.
Sophisticated methods, such as the Inductively Coupled Plasma-Optical Emission Spectroscopy (ICP-OES) technique, are not accessible or user-friendly for laypeople and farmers because they involve complex and time-consuming procedures and heavily depend on advanced laboratory facilities. A portable, user-friendly device that can be operated by non-experts holds significant advantages from both social and economic standpoints.
Emphasising the potential impact of this technology, IIT-Madras Professor Sreeram K Kalpathy stated that given the heavy reliance of the Indian population on agriculture, there is an urgent need for technological solutions to detect and measure heavy metal concentrations. This would empower farmers with the information necessary to make informed decisions about which crops to cultivate and when to make interventions.
Current research efforts are focused on achieving higher resolution detection capabilities for copper, lead, and cadmium (in parts per million levels), as well as attaining the selective detection of specific metals.
The team is presently in the process of conducting tests on real soil and water samples to validate the concept. In this regard, with the assistance of the Rural Technology Action Group at IIT-Madras (RUTAG-IITM), they have also analysed water quality and the presence of heavy metals in water samples gathered from various temple tanks in Rameswaram, Tamil Nadu. The aim is to have the technology validated and demonstrated in a field environment over the next 3-5 years.
The government has committed to rejuvenating 75 water bodies in each district of the country. Last month, the Meghalaya state government announced plans to deploy an artificial intelligence (AI)-powered robotic boat to clean Umiam Lake, which is polluted with plastic waste.
As OpenGov Asia reported, the Umkharh and Umshyrpi rivers course through Shillong, the state capital, carrying substantial quantities of plastic waste daily and depositing it into the southern portion of the lake. This area is only accessible by boat.
As part of the Smart Village Movement, a non-profit collaborating with the state government on various initiatives, a Hong Kong company was selected to showcase its cleaning technology. The small boat brought by the company can swiftly remove 200-400 kg of waste each day, allowing for a speedy cleanup of all the waste within the next few months if the larger boat is put into operation. Currently, the company has boats that clean waste in Varanasi and Bengaluru.
In a strategic move to bolster its semiconductor industry, the Ministry of Economic Affairs (MOEA) in Taiwan is poised to allocate approximately NT$800 million (S$25,084,582) to support local integrated circuit (IC) designers in the development of processes below 28 nanometres.
This substantial investment forms a crucial part of the budget earmarked for the upcoming semiconductor industry innovation project proposed by the National Science and Technology Council, awaiting final approval from the Cabinet, as confirmed by the Industrial Development Bureau under the MOEA.
ICs, the intricate assemblies of electronic components, encompassing transistors, resistors, and capacitors, have become the bedrock of modern technology. These miniature marvels are crafted on wafer-thin semiconductor substrates, underpinning a plethora of electronic devices and systems.
In safeguarding the interests of local enterprises against a highly competitive market landscape, the bureau’s subsidy programme will be geared toward companies actively engaged in the development of advanced techniques aligned with international industry trends. These include artificial intelligence (AI), smart cockpit solutions, and communication technologies.
Taiwan boasts around 200 small and medium-sized IC design firms, but only a fraction possesses the capability to venture into the intricate domains of 16nm or 14nm processes, which tend to be financially daunting for companies of their size.
To encourage participation and innovation, detailed eligibility criteria for the subsidies will be disclosed at the outset of the coming year. The government is prepared to provide financial support of up to half the amount applied for by these enterprises.
The expected timeline for reaping the rewards of this investment is promising, with the government anticipating tangible benefits within two to three years. As the global semiconductor landscape continues to evolve and confront new challenges, Taiwan’s strategic focus on nurturing homegrown talent and fostering innovation in IC design underscores its commitment to maintaining a competitive edge in this pivotal industry.
The investment in IC design processes below 28 nanometres not only fortifies Taiwan’s position as a technological powerhouse but also ensures its resilience in the face of dynamic global forces. By empowering its local talent and businesses, Taiwan stands ready to navigate the complex semiconductor terrain and emerge as a formidable player in the evolving semiconductor industry.
Electronic gadgets such as computers, cellphones, televisions, and medical equipment may all function more intelligently and efficiently due to semiconductors, which allow digital data to be translated into the real world. They enable lightning-fast data processing, storage, and transmission by facilitating the complex dance of electrons.
Semiconductors are essential to more than just consumer electronics. They serve as the foundation for sectors where exact control and dependability are crucial, such as the automobile, aerospace, healthcare, and renewable energy industries.
Semiconductors are still developing in this age of rapidly developing technology, which makes it possible to create devices with smaller sizes, quicker processors, and ground-breaking inventions. They are the unsung heroes who are paving the way for an infinite future while subtly influencing our digital environment.
Partnerships are also essential for supporting the semiconductor sector since they act as sparks for creativity and provide answers to difficult problems. Governments, academic institutions, and semiconductor businesses work together in this cooperative manner, with each group providing special skills and resources.
Partnerships additionally enhance the robustness of the supply chain. Businesses can better survive disruptions by strengthening the connections between various phases of semiconductor manufacture, as the COVID-19 epidemic showed.
Vietnam intends to start shutting down its 2G network by December, creating space for the advancement of more modern telecommunication technologies. According to the government, the 2G mobile network, initially introduced in Vietnam in 1993, has become obsolete and can no longer satisfy user demands or keep pace with the expansion of telecommunications services.
Therefore, the Authority of Telecommunications under the Ministry of Information and Communications (MIC) is considering the complete shutdown of the 2G network. Director of the Authority, Nguyen Thanh Phuc, mentioned that the agency conducted meetings with telecom service providers in Vietnam, and these providers have committed to initiating the blocking of 2G-only devices starting in December.
As per its document released on 27 September 2022, MIC has taken steps to deactivate the 2G network across the entire country. Additionally, service providers have devised technical solutions to phase out devices that rely solely on 2G and 3G networks.
The complete switch-off is intended to optimise frequency reserves for the development of modern telecommunication technologies, such as 4G and 5G. MIC is assisting telecom service providers in devising roadmaps and transition plans for discontinuing 2G services and facilitating the migration of users to 4G and 5G networks. The objective is to reduce the number of 2G mobile subscriptions to approximately 6 million, which would represent less than 5% of the total, by the end of the year, with a complete shutdown of the 2G network planned for 2024.
According to data from service providers, at the beginning of 2023, there were over 26 million 2G mobile subscriptions, constituting about 20% of the total 126 million mobile subscriptions nationwide. However, this number decreased to 23 million as of August.
The discontinuation of 2G services has been implemented in several countries, including Japan (in 2011), Singapore (in 2017), and China (in 2021). As of October 2022, 142 telecom service providers in 56 countries and territories made plans to shut down 2G and 3G networks, and 51 of them turned off 2G services.
Earlier this month, MIC announced the setting up of a team to accelerate 6G equipment development. The team works in collaboration with internal agencies and three major telecommunications carriers, including the state-run group Viettel.
As OpenGov Asia reported, the group reviews the system of legal documents to encourage the 6G technology ecosystem. It also tests and evaluates 6G equipment. The Deputy Director of the Authority of Information Technology and Communications Industry, Nguyen Thien Nghia, oversees the team.
The group puts forth management, assessment, inspection, and testing regulations regarding 6G equipment. The government believes that better guidelines and a clear technology framework will lead to more secure 6G networks in the future.
The team is also responsible for gathering international case studies to build a strategy for the development, assessment, and testing of equipment in Vietnam. The group monitors the 6G equipment research and development around the world, collecting information on equipment types, supportive bands, prices, and standardisation.
It will attend 6G technology conferences and seminars both abroad and in the country. The group will work on fostering international cooperation in the research and development of 6G technology and equipment.
The commencement of the 6G standard and its commercial rollout is anticipated to begin around 2028, with widespread commercial deployment likely occurring in 2030. 6G networks will revolve around both humans and machines, offering advanced services such as augmented reality, high-precision mobile holograms, and digital replicas.
Smart homes will be widely adopted when smart devices can be remotely connected and controlled. Additionally, the deployment of intelligent traffic management systems, autonomous vehicles, and flying taxis can be facilitated using 6G network technology.